Micron® e.MMC memory solutions
For automotive, industrial & consumer applications
For system designs with mass storage needs, developers must keep up with the increasingly complex error correction code (ECC) implementation and data management requirements of TLC NAND flash devices. Micron’s e.MMC memory can help developers overcome these challenges, offering quick system integration suited for a wide range of automotive, industrial and consumer applications.
Buy nowDatasheet
Memory is at the heart of Micron
Five ways e.MMC can benefit your design
- Choose from automotive, industrial and consumer grade e.MMC solutions to meet your
specific needs.
1. Broad portfolio
- Flexibility to configure as per specific application requirement.
2. Dual voltage support
- Build product that last with our superior e.MMC endurance.
3. Superior endurance
- Industry-standard 153-ball BGA
- JEDEC-compliant 100-ball BGA: enable easier routing, lower board cost and better signal intergrity
4. Flexibility
Pick the package that's right for you:
- Get the best quality and product longevity for automotive applications from our automotive qualified e.MMC memory.
5. Automotive qualification
How e.MMC memory works
Micron’s e.MMC memory combines a NAND flash memory device with a JEDEC-compliant controller in an industry-standard BGA package. This single-package solution manages operations—such as wear levelling, bad block management and device mapping— internally, simplifying system development work. e.MMC also implements error handling internally, which removes the burden from the host processor, thereby optimizing system performance.
Automotive applications
- Advance driver assistance systems
- Cluster/dashboard
- Infotainment
- Drive data recorder
Industrial applications
- Factory/building automation
- Point of sales
- Energy
- Transportation
- Aerospace and defense
- Surveillance
- Medical equipment
Consumer applications
- Digital TVs (DTV)
- Set-top boxes (STB)
- Home automation
- Digital video cameras (DVC)
- Digital still cameras (DSC)
- Augmented reality/virtual reality (AR/VR)
- Wearables
Micron e.MMC memory performance summary
| Specs | e.MMC | e.MMC v5.0/v5.1 |
|---|---|---|
| Density | 2GB up to 64GB | 4GB up to 128GB |
| Ballout and package | Industry-standard 153-ball BGA JEDEC-standard 100-ball BGA for easy routing | |
| Sequential write | Up to 20/23 MB/s | Up to 90/120 MB/s |
| Sequential read | Up to 44/130 MB/s | Up to 270/320 MB/s |
| Random write | Up to 100/1000 IOPS | Up to 5000/15,000 IOPS |
| Random read | Up to 1100/3500 IOPS | Up to 5000/15000 IOPS |
| Temperature | Industrial (–40˚C to 85˚C)Automotive (–40˚C to 105˚C) |